DS1067
						
						2.00mm Wafer & Housing SAN Type
					
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						- Drawing
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						| 产品系列 | DS1067 | 
| 间距 | 2.00mm | 
| 产品描述 | Wafer & Housing SAN Type | 
| Pin数范围 | 2~15 | 
| 产品种类 | 线对板 | 
| 符合焊接温度 | 240±5℃ | 
| 额定电流 | 1.5A(AWG#24) | 
| 额定电压 | 125V | 
| 接触阻抗 | 30mΩ 最大 | 
| 绝缘阻抗 | 1000MΩ最小 | 
| 耐电压 | 500V AC 1分钟 | 
| 操作温度 | -25~+85℃ | 
| 适用线径 | AWG#30~#24 | 
					 
					
						| 塑胶材料 | 热塑性塑胶 | 
| 塑胶常规颜色 | 白色/透明色 | 
| Pin针端子材料 | 铜合金 | 
| Pin针端子常规电镀 | 镀锡 | 
					 
					
						
						
							
								
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									| ![]() HF | / | 
								
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									| ![]() PFOR | / | 
								
									| ![]() SS-00259 | / |