DS1067
2.00mm Wafer & Housing SAN Type
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- Drawing
- Specifications
- Material information
- Certifications
- Lead Free Type
- Packaging specifications
产品系列 | DS1067 |
间距 | 2.00mm |
产品描述 | Wafer & Housing SAN Type |
Pin数范围 | 2~15 |
产品种类 | 线对板 |
符合焊接温度 | 240±5℃ |
额定电流 | 1.5A(AWG#24) |
额定电压 | 125V |
接触阻抗 | 30mΩ 最大 |
绝缘阻抗 | 1000MΩ最小 |
耐电压 | 500V AC 1分钟 |
操作温度 | -25~+85℃ |
适用线径 | AWG#30~#24 |
塑胶材料 | 热塑性塑胶 |
塑胶常规颜色 | 白色/透明色 |
Pin针端子材料 | 铜合金 |
Pin针端子常规电镀 | 镀锡 |
UL
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CE
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FCC
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ROHS
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VDE
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CCC
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CB
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ROHS 2.0 |
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REACH |
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HF |
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PFOS |
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PFOR |
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SS-00259 |
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