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DS1147-01

DS1147-01
1.00mm SMT Type Wafer & Housing

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  • Drawing
  • Specifications
  • Material information
  • Certifications
  • Lead Free Type
  • Packaging specifications
Product seriesDS1147-01
Pitch1.0mm
Product description1.00mm SMT Type Wafer & Housing
No.of contacts02~16
Products type Wire to Board
Mounting typeSMT
Coldering temperature260±5℃
Rated currency1A Max
Rated voltage50V AC/DC
Contact resistance20mΩ Max
Insulation resistance100MΩ minimum
Withstand voltage250V AC 1minitue
Operation temperature(-25~+85)℃






Housing materialLCP/PA66
Plastic flame ratingUL94 V0
Housing colorIvory/White
Pin materialCopper alloy
Pin plating Tin plating






UL 		/
CE 		/
FCC 		/
ROHS 		/
VDE 		/
CCC 		/
CB 		/
ROHS 2.0 /
REACH /
HF /
PFOS /
PFOR /
SS-00259 /
Packing typeReel/Polybag