Product series | DS1070-06 |
Pitch | 2.54mm |
Product description | Wafer & Housing Crimp Type |
No.of contacts | 2~18 |
Products type | Wire to Board |
Mounting type | V/T R/A Crimp |
Coldering temperature | 240±5℃ |
Rated currency | 3A Max |
Rated voltage | 250V AC/DC |
Contact resistance | 30mΩ Max |
Insulation resistance | 1000MΩ minimum |
Withstand voltage | 500V AC 1minitue |
Operation temperature | (-25~+85)℃ |
Applicable wire diameter | 24~28AWG |
Housing material | Nylon |
Plastic flame rating | UL94 V0 |
Housing color | Black |
Pin material | Copper alloy |
Pin plating | Gold/Tin |
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ROHS 2.0 | / |
REACH | / |
HF | / |
PFOS | / |
PFOR | / |
SS-00259 | / |
Packing type | Polybag/Reel |