DS1070-06

DS1070-06
2.54mm wafer & Housing Crimp Type

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  • Drawing
  • Specifications
  • Material information
  • Certifications
  • Lead Free Type
  • Packaging specifications
Product seriesDS1070-06
Pitch2.54mm
Product descriptionWafer & Housing Crimp Type
No.of contacts2~18
Products type Wire to Board
Mounting typeV/T R/A Crimp
Coldering temperature240±5℃
Rated currency3A Max
Rated voltage250V AC/DC
Contact resistance30mΩ Max
Insulation resistance1000MΩ minimum
Withstand voltage500V AC 1minitue
Operation temperature(-25~+85)℃
Applicable wire diameter24~28AWG




Housing materialNylon
Plastic flame ratingUL94 V0
Housing colorBlack
Pin materialCopper alloy
Pin plating Gold/Tin




UL
/
CE
/
FCC
/
ROHS
/
VDE
/
CCC
/
CB
/
ROHS 2.0 /
REACH /
HF /
PFOS /
PFOR /
SS-00259 /
Packing typePolybag/Reel