DS1069-03
2.50mm Wafer & Housing
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- Drawing
- Specifications
- Material information
- Certifications
- Lead Free Type
- Packaging specifications
| Product series | DS1069-03 |
| Pitch | 2.50mm |
| Product description | 2.54mm Wafer & Housing |
| No.of contacts | 2~20 |
| Products type | Wire to Board |
| Mounting type | V/T R/A Crimp |
| Coldering temperature | 240±5℃ |
| Rated currency | 3A Max |
| Rated voltage | 250V AC/DC |
| Contact resistance | 30mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 600V AC 1minitue |
| Operation temperature | (-25~+85)℃ |
| Applicable wire diameter | 22~28AWG |
| Housing material | PA66 |
| Plastic flame rating | UL94 V0 |
| Housing color | White/Ivory |
| Pin material | Copper alloy |
| Pin plating | Tin plating |
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ROHS
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VDE
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CCC
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CB
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 ROHS 2.0 |
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 REACH |
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