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DS1069-01

DS1069-01
2.50mm Wafer & Housing EH Type

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  • Drawing
  • Specifications
  • Material information
  • Certifications
  • Lead Free Type
  • Packaging specifications
Product seriesDS1069-01
Pitch2.50mm
Product descriptionWafer & Housing EH Type
No.of contacts2~20
Products type Wire to Board
Mounting typeV/T R/A Crimp
Coldering temperature240±5℃
Rated currency3A Max
Rated voltage250V AC/DC
Contact resistance30mΩ Max
Insulation resistance1000MΩ minimum
Withstand voltage600V AC 1minitue
Operation temperature(-25~+85)℃
Applicable wire diameter22~30AWG






Housing materialPA66
Housing colorWhite
Pin materialCopper alloy
Pin plating Tin plating






UL 		/
CE 		/
FCC 		/
ROHS 		/
VDE 		/
CCC 		/
CB 		/
ROHS 2.0 /
REACH /
HF /
PFOS /
PFOR /
SS-00259 /
Packing typePolybag/Reel