| Product series | DS1066-08 |
| Pitch | 2.00mm |
| Product description | 2.00mm PH Wafer Horizontal SMT Type |
| No.of contacts | 2~16 |
| Products type | Wire to Board |
| Mounting type | SMT |
| Coldering temperature | 260±5℃ |
| Rated currency | 2A Max |
| Rated voltage | 100V AC/DC |
| Contact resistance | 30mΩ Max |
| Insulation resistance | 1000MΩ minimum |
| Withstand voltage | 500V AC 1minitue |
| Operation temperature | (-25~+85)℃ |
| Housing material | PA-9T |
| Plastic flame rating | UL94 V0 |
| Housing color | Ivory |
| Pin material | Copper alloy |
| Pin plating | Tin |
|
/ |
|
/ |
|
/ |
|
/ |
|
/ |
|
/ |
|
/ |
ROHS 2.0 |
/ |
REACH |
/ |
|
|
/ |
|
|
/ |
|
|
/ |
|
|
/ |
| Packing type | Reel |