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DS1066-01

DS1066-01
2.00mm Wafer & Housing PHD Type

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  • Drawing
  • Specifications
  • Material information
  • Certifications
  • Lead Free Type
  • Packaging specifications
Product seriesDS1066-01
Pitch2.00mm
Product descriptionWafer & Housing PHD Type
No.of contacts2~15
Products type Wire to Board
Mounting typeV/T R/A Crimp
Coldering temperature240±5℃
Rated currency2A Max
Rated voltage250V AC/DC
Contact resistance30mΩ Max
Insulation resistance1000MΩ minimum
Withstand voltage500V AC 1minitue
Operation temperature(-25~+85)℃
Applicable wire diameter24~28AWG




Housing materialPA66
Plastic flame ratingUL94 V0
Housing colorIvory
Pin materialCopper alloy
Pin plating Tin




UL 		/
CE 		/
FCC 		/
ROHS 		/
VDE 		/
CCC 		/
CB 		/
ROHS 2.0 /
REACH /
HF /
PFOS /
PFOR /
SS-00259 /
Packing typePolybag/Reel